Special Section on InterPACK2021
نویسندگان
چکیده
The International Technical Conference and Exhibition on Packaging Integration of Electronic Photonic Microsystems (InterPACK) is a flagship conference ASME Division (EPPD). It has served as an international forum within the society to share exchange latest progresses in research, development, applications electronic photonic packaging since 1992. aim Journal (JEP) Special Section for InterPACK publish outstanding papers from technical tracks InterPACK2021, which was held virtually amid COVID-19 pandemic worldwide. This JEP publishes nine presented at InterPACK2021 areas electronics photonics packaging, micro-electronics reliability, advanced thermal management silicon, package, data center level. All published this went through standard peer-review process journal by ASME.The industry facing challenges meet demanding performance functional needs high-performance computing (HPC), artificial intelligence (AI), 5 G/mm Wave, power devices. In order close gap, parallel with new breakthroughs advancing silicon node, semiconductor also embracing integrated circuits (IC) technologies, including heterogeneous integration, 2.5D/3D IC chiplet, additive manufacturing, novel modeling characterization techniques, others. reflects publishing InterPACK2021. We gratefully acknowledge all authors who have revised their original reviewers spent tremendous time efforts help improve overall quality Section. would like thank Editor-in-Chief (EIC), Professor Shi-Wei Ricky Lee his guidance support, assistant EIC, Dr. Jeffery Lo journey.
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 2023
ISSN: ['1528-9044', '1043-7398']
DOI: https://doi.org/10.1115/1.4056558